For other epoxy resin hardener

Our products can be also used as an epoxy resin hardener for various applications other than the semiconductor encapsulation materials, the liquid encapsulation materials, the printed circuit boards.
The cured resins provided by the epoxy resin and the phenolic resin have a good electric insulation, acid-resistance, heat-resistance and water resistance.
These feauture can be used as an epoxy resin hardener for paint and adhesive and so on.
You can choose the our products depending on demands, or usege.

Standard type

Grade Softening
Point
[℃]※1
Melting
viscosity
[Pa・s]※2
OH equivalent
[g/eq]
Feature
H、HF-series 67~104 0.03~1.2 103~109 Highly purity, standard
※H-4~HF-4M
DL-92 88~92 0.15~0.35 103~109 High heat resistance, Dimerless
※1. Mettler method    ※2. 150℃

Sharp molecular weight distribution (Tetrammer is main ingredient)
Good heat resistance, Good flowability, Toughness

High adhesiveness, Low moisture absorption type

Grade Softening
Point
[℃]※1
Melting
viscosity
[Pa・s]※2
OH equivalent
[g/eq]
Feature
MEHC-7800-series 61~90 0.07~0.85 167~180 High adhesiveness,
Low moisture absorption
MEHC-7851-series 64~85 0.04~0.44 201~220 Halogen free flame reterdancy
High adhesiveness, Low moisture
absorption
MEHC-7841-4S 58~65 0.04~0.06 164~168 Low viscosity, Halogen free flame
reterdancy
High adhesiveness, Low moisture absorption
※1. Mettler method    ※2. 150℃

High heat resistance

Grade Softening
Point
[℃]※1
Melting
viscosity
[Pa・s]※2
OH equivalent
[g/eq]
Feature
MEH-7500 107~113 0.73~1.03 95~99 High heat resistance
MEH-7600-4H 150~160 - 98~102 Ultra high heat resistance
※1. Mettler method    ※2. 150℃

Low CTE, Low moisture absorption type

Grade Softening
Point
[℃]※1
Melting
viscosity
[Pa・s]※2
OH equivalent
[g/eq]
Feature
MEH-7000 116~121 1.91~2.78 141~145 Low CTE, Low moisture absorption type
※1. Mettler method    ※2. 150℃

※The data mentioned above are not guaranteed values, but representative ones.