For printed circuit boards

We have phenolic resin of various structure as a lineup.Solution viscosity of varnish and heat resistance can be adjusted by monomer selection or control of molecular weight distribution.
Our high heat resistance type have good solubility to organic solvent for better handlability as well as thermal stability.
High adhesiveness・low moisture absorption type indicate good electrical properties that is due to low density of hydroxy group as well as good adheisiveness and hydrophobic property.
In addition, we can offer the customized resin depending on demand properties excepting listed grade below.
Please feel free to contact us.

Standard type

Grade Softening
Point[℃]※1
Melting
viscosity[Pa・s]※2
OH equivalent
[g/eq]
Feature
H、HF-series 67~104 0.03~1.2 103~109 High purity, standard
※H-4~HF-4M
DL-92 88~92 0.15~0.35 103~109 High heat resistance, Dimerless
※1. Mettler method    ※2. 150℃

High adhesiveness, Low moisture absorption type

Grade Softening
Point[℃]※1
Melting
viscosity[Pa・s]※2
OH equivalent
[g/eq]
Feature
MEHC-7800-series 61~90 0.07~0.85 167~180 High adhesiveness,
Low moisture absorption
MEHC-7851-series 64~85 0.04~0.44 201~220 Halogen free flame reterdancy
High adhesiveness, Low moisture absorption
MEHC-7841-4S 58~65 0.04~0.06 164~168 Low viscosity, Halogen free flame reterdancy High adhesiveness, Low moisture absorption
※1. Mettler method    ※2. 150℃

High heat resistance

Grade Softening
Point[℃]※1
Melting
viscosity[Pa・s]※2
OH equivalent
[g/eq]
Feature
MEH-7500 107~113 0.73~1.03 95~99 High heat resistance
MEH-7600-4H 150~160 - 98~102 Ultra high heat resistance
※1. Mettler method    ※2. 150℃

Low CTE, Low moisture absorption type

Grade Softening
Point[℃]※1
Melting
viscosity[Pa・s]※2
OH equivalent
[g/eq]
Feature
MEH-7000 116~121 1.91~2.78 141~145 Low CTE, Low moisture absorption type
※1. Mettler method    ※2. 150℃

Solbillity data

Grade Standard
type
Triphenyl
methane
type
Tetrakis
phenol
ethane
type
Xylylene
type
Biphenylene
type
aphthol/Cresol
type
HF / DL-92 MEH-7500 MEH-7600-4H MEHC-7800
series
MEHC-7851
series
MEH-7000
Methylethl ketone
Ethyl cellosolve ×
Dimethylformamide ×
Methanol ○〜×
Isopropanol × ○〜×
【solubility】  ○: soluble、no precipitate@27℃ △: Soluble、precipitate@27℃ ×: Insolble
What is “printed circuit board”

We have phenolic resin of various structure as a lineup.Solution viscosity of varnish and heat resistance can be adjusted by monomer selection or control of molecular weight distribution.
Our high heat resistance type have good solubility to organic solvent for better handlability as well as thermal stability.
High adhesiveness・low moisture absorption type indicate good electrical properties that is due to low density of hydroxy group as well as good adheisiveness and hydrophobic property.
In addition, we can offer the customized resin depending on demand properties excepting listed grade below.
Please feel free to contact us.



※The data mentioned above are not guaranteed values, but representative ones.