For liquid encapsulation materials
This feauture of liquid state at room temperature can be applied for liquid encapsulation,underfill, conductive paste application.
non-solvent liquid type
|OH equivalent [g/eq]||Feature|
|MEH-8000H||1500～3500||139～143||Low viscosity type|
|MEH-8005||4500～7500||133～138||High viscosity type|
The main purpose of the underfill is improvement of impact resistance, and thermal cycle performance enhanced by the coefficient of expansion difference between IC chip and PCB.
The underfill is filling in the gap of IC chip and PCB by capillary phenomenon, it becomes stiff to develop a function.
Because the epoxy resin composition of the underfill needs a liquid state under room temperature, MEH-8000-series is used.
※The data mentioned above are not guaranteed values, but representative ones.