For semiconductor encapsulation materials

The phenolic resin is used as raw materials of the encapsulation materials by the formulation of epoxy resin, silica.
We produces the phenolic resin having the high purity and quality, so it can be used with confidence in the electronic field.
In addition, we have phenolic resin of various structure as a lineup.
We can offer and customize the product depending on demands such as the flowability, heat-resistance, halogen free flame-reterdancy.Please feel free to ask us.

Standard type

Grade Softening
Point
[℃]※1
Melting
viscosity
[Pa・s]※2
OH equivalent
[g/eq]
Feature
H、HF-series 67~104 0.03~1.2 103~109 High purity, standard
※H-4~HF-4M
DL-92 88~92 0.15~0.35 103~109 High heat resistance, Dimerless
※1. Mettler method    ※2. 150℃

Sharp molecular weight distribution (Tetrammer is main ingredient)
Good heat resistance, Good flowability, Toughness

High adhesiveness, Low moisture absorption type

Grade Softening
Point
[℃]※1
Melting
viscosity
[Pa・s]※2
OH equivalent
[g/eq]
Feature
MEHC-7800-series 61~90 0.07~0.85 167~180 High adhesiveness,
Low moisture absorption
MEHC-7851-series 64~85 0.04~0.44 201~220 Halogen free flame reterdancy
High adhesiveness, Low moisture
absorption
MEHC-7841-4S 58~65 0.04~0.06 164~168 Low viscosity, Halogen free flame
reterdancy
High adhesiveness, Low moisture absorption
※1. Mettler method    ※2. 150℃

High heat resistance

Grade Softening
Point
[℃]※1
Melting
viscosity
[Pa・s]※2
OH equivalent
[g/eq]
Feature
MEH-7500 107~113 0.73~1.03 95~99 High heat resistance
MEH-7600-4H 150~160 - 98~102 Ultra high heat resistance
※1. Mettler method    ※2. 150℃

Low CTE, Low moisture absorption type

Grade Softening
Point
[℃]※1
Melting
viscosity
[Pa・s]※2
OH equivalent
[g/eq]
Feature
MEH-7000 116~121 1.91~2.78 141~145 Low CTE, Low moisture absorption type
※1. Mettler method    ※2. 150℃
What is “semiconductor encapsulation materials”

The semiconductor encapsulation materials are used for the purpose of protecting IC equipped with the electronic equipment such as PC, Smartphone, Tablet from the external environment such as a shock, light, heat, and the humidity.
The main components of the encapsulation material are inorganic fillers such as the silica, and the epoxy resin is used as a binder.
Our products is used as a hardener of this epoxy resin.
In addition, the phenolic resin is also used as raw materials of epoxy resin for encapsulation materials.


※The data mentioned above are not guaranteed values, but representative ones.